New Products
Encapsulation Pick and Place System
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4 Target DC or RF sputtering system by EITI
Bulkhead mount allows access in grey area to save on valuable fabrication space. Computer controlled loadlocked system with base pressure 2x10-8 torr provides ideal system for metals in
A EITI 603-3 Target Sputtering Systems
Either DC or RF sputter capabilities Computer controlled for up to 300mm wafer si
MFD-300 Wafer Cleaning or Flux Dispense System
Fully Automated Robotically controlled, can include backend system with Buffer/Indexer to store 300mm wafers, robot and foup for exit wafers.
MFD-300 Facility Drawings (Download; Adobe Reader PDF)
MFD-300 Buffer Index Drawings (Download; Adobe Reader PDF)
EITI Gen 2 Flat Panel Ash/Etch for organics
Features High density downstream source called the Revolution by MKS Instruments. System includes 2000 watt RF generator, turbomolecular pump optional and spectrometer endpoint by Ocean Optics. Low temperature operation <100 degrees Centigrade optional or standard heated chuck for ashing >250 degrees Centigrade. Robotically controlled load/unload with National Instruments Labview operating system and software makes this a production worthy asher for large area panel processing.
R&D single wafer plasma etch systems
...Using characterized process chambers from all major Etch manufacturers cluster modules. Includes EITI PC based control system and software gas box (4 or more gases) AC distribution, magnetically coupled vacuum loadlock and robotics built in. Allows qualified existing processes to etch silicon nitride, silicon dioxide, aluminum, Titanium, GaAs, deep silicon etch, and many others to qualify dielectric or metal etches using standard recipes from the major etch companies. Once qualified for your process, integration to standard cluster tool environments is seamless. All connections use existing plugs for upgrade to cluster tools at a later time. Low cost and ease of integration where small footprint is important.
EITI Vacuum Robot
uses magnetically coupled system for very low pressure capabilities. Direct drive motors provide unmatched accuracy and reliability when compared to robots with drive belts. Simplicity at its best makes for a high volume production robot.
EITI’s R&D loadlock chamber
Capable of processing up to 300mm substrates. Choices of MESC capable gate valves or standard Applied gates to accommodate many different process cluster modules from the major manufacturers. Includes built in vacuum robot. Loadlock keeps the operator from dangerous gas exposure and provides consistent process results by eliminating moisture and air into the process chamber between wafer load and unload cycles.
Production tested control system by EITI
includes standard electronic boards from National Instruments for ease of replacement and the field proven Labview software object oriented software system. Labview is in use at many universities and has become the premier controls software of many automated equipment companies.
Example: Operator screen of a plasma etch system shows real time running parameters of pressure, ICP power, RIE Power, gas flows for up to 5 gases. Real time schematic show operation of turbo pump and pendulum valve for fast accurate control of all parameters. Endpoint system is Ocean Optics spectrometer with unlimited wavelength selection for either endpoint or diagnostic purposes. Operator, Engineer, and Maintenance levels prevents untrained personnel from accessing critical settings
P5000 MxP Oxide etch module
Provides the ideal R&D etch platform for University and New company process development. Low cost compared to new systems parts availability throughout the US is established with many secondary suppliers of Applied equipment